Development of horizontal elements in 3-D microcontacts

This paper describes the development and production of horizontal elements in three-dimensional (3-D) microcontacts, implemented in package to PCB assembly. Instead of the standard vacuum deposition process of metal films onto dielectric interfaces, an alternative method aiming at simplicity and lower-cost relative to the technology roadmap, is proposed. This method employs chemical activation and pretreatment of the dielectric photoresist surface with fluid carbon content substance, thus providing also electrical conductivity for direct metal electroplating. A special regime of reverse electrochemical deposition is applied in order to enhance the adhesion of the layer deposited onto the activated surface. This paper presents experimental results of the horizontal elements investigation relative to 3-D microcontacts.