Analysis of superconducting transmission-line structures for passive microwave device applications

Author

Lee, L.H. ; Ali, S.M. ; Lyons, W.G. ; Oates, D.E. ; Goettee, J.D.

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA

Volume

3

Issue

1

fYear

1993

fDate

3/1/1993 12:00:00 AM

Firstpage

2782

Lastpage

2787

Abstract

A full-wave spectral-domain volume-integral-equation technique is used to calculate the complex propagation constant, the complex characteristic impedance, and the current distribution for Nb and YBa/sub 2/Cu/sub 3/O/sub 7-x/ microstrip lines and coplanar waveguides with superconducting ground planes. Measurements of resonant frequency and quality factor are performed on Nb microstrip and coplanar waveguide resonators, and the results are compared with numerical calculations. The power-handling capability of various superconducting transmission-line structures is calculated. Results of phase noise measurements on Nb microstrip resonators suggest that phase noise may be related to the current distribution in the structure.<>

Keywords

Q-factor; current distribution; electric impedance; electron device noise; high-temperature superconductors; integral equations; microstrip components; resonators; spectral-domain analysis; strip line components; superconducting microwave devices; CPW resonators; Nb; Nb and YBa/sub 2/Cu/sub 3/O/sub 7-x/; complex characteristic impedance; complex propagation constant; coplanar waveguides; current distribution; full-wave spectral-domain volume-integral-equation; microstrip lines; passive microwave device applications; phase noise measurements; power-handling capability; quality factor; resonant frequency; superconducting ground planes; superconducting transmission-line structures; Coplanar waveguides; Current distribution; Impedance; Microstrip resonators; Niobium; Phase noise; Planar waveguides; Propagation constant; Superconducting device noise; Transmission lines;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.233504

Filename

233504