1 /spl times/ 12 VCSEL array with optical monitoring via flip-chip bonding

Author

Goossen, K.W. ; Cunningham, J.E. ; Krishnamoorthy, A.V.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE

Volume

18

Issue

11

fYear

2006

fDate

6/1/2006 12:00:00 AM

Firstpage

1219

Lastpage

1221

Abstract

A vertical-cavity surface-emitting laser (VCSEL) 1 times 12 array flip-chip bonded to a 1 times 12 GaAs monitor photodiode array is demonstrated, and faithful monitoring of the VCSEL threshold current, optical power, and subthreshold emission is recorded. Extremely small monitor crosstalk is measured. This is the first published report of an optically monitored VCSEL array

Keywords

flip-chip devices; integrated circuit bonding; monitoring; optical crosstalk; photodiodes; semiconductor device measurement; semiconductor laser arrays; surface emitting lasers; GaAs; GaAs monitor photodiode array; VCSEL array; crosstalk; flip-chip bonding; optical monitoring; subthreshold emission; threshold current; vertical-cavity surface-emitting laser; Bonding; Gallium arsenide; Monitoring; Optical arrays; Optical crosstalk; Optical recording; Power lasers; Stimulated emission; Surface emitting lasers; Vertical cavity surface emitting lasers; Flip-chip bonding; optical monitor; vertical-cavity surface-emitting laser (VCSEL);

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2006.874683

Filename

1634549