DocumentCode :
942235
Title :
Thermal Characterization of Electronic Packages Using the Nyquist Plot of the Thermal Impedance
Author :
Kawka, Piotr ; De Mey, Gilbert ; Vermeersch, Bjorn
Author_Institution :
Agilent Technol., Diegem
Volume :
30
Issue :
4
fYear :
2007
Firstpage :
660
Lastpage :
665
Abstract :
It will be shown in this contribution that if the thermal impedance Zth(jw)of an electronic package is represented in a Nyquist plot, the curve obtained can be fitted very well to a combination of a few (n) circles, n varying between 2 and a maximum of 5. For each of these circles, it is sufficient to know the radius and the coordinates of the center point or just three parameters. With 3n parameters the entire behavior of the impedance can be represented and consequently, the dynamic behavior as well.
Keywords :
electric impedance; thermal management (packaging); Nyquist plot; electronic package; thermal characterization; thermal impedance; Dynamic behavior; Nyquist plot; electronic package; thermal characterization; thermal impedance;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2007.906308
Filename :
4358517
Link To Document :
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