DC-SQUID system with flexible pickup coil connected by a novel superconducting technique

Author

Chinone, K. ; Chiba, N. ; Nakayama, S. ; Shimizu, N. ; Kiryu, S. ; Kasai, N.

Author_Institution

Seiko Instrum. Inc., Chiba, Japan

Volume

3

Issue

1

fYear

1993

fDate

3/1/1993 12:00:00 AM

Firstpage

1898

Lastpage

1901

Abstract

A reliable and compact bonding method for superconductively connecting input coils to pickup coils has been developed using a low-temperature flip-chip bonding technique which does not cause the deterioration of Josephson junctions. Axial first-order gradient pickup coils made of a flexible sheet were fabricated and tested to investigate their mass producibility. The system noise of a single-channel system with a flexible pickup coil, with 17-mm coil diameter and 60-mm baseline, connected by a superconductive flip-chip bonding technique, was about 20 fT/ square root Hz using a large beta L DC-SQUID (superconducting quantum interference device).<>

Keywords

SQUIDs; flip-chip devices; superconducting magnets; 17 mm; 60 mm; DC-SQUID system; Josephson junctions; axial first order gradient pickup coils; flexible pickup coil; flexible sheet; input coils; low-temperature flip-chip bonding technique; mass producibility; reliable compact bonding method; single-channel system; system noise; Bonding; Interference; Joining processes; Josephson junctions; SQUIDs; Superconducting coils; Superconducting device noise; Superconducting devices; Superconductivity; Testing;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.233591

Filename

233591