DocumentCode :
942660
Title :
A novel microstrip-compatible technique for depositing YBa/sub 2/Cu/sub 3/O/sub 7- delta / on both surfaces of a substrate
Author :
Pond, J.M. ; Carroll, K.R. ; Chrisey, D.B. ; Horwitz, J.S. ; Cestone, V.C.
Author_Institution :
US Naval Res. Lab., Washington, DC, USA
Volume :
3
Issue :
1
fYear :
1993
fDate :
3/1/1993 12:00:00 AM
Firstpage :
1711
Lastpage :
1714
Abstract :
A technique for the deposition of YBa/sub 2/Cu/sub 3/O/sub 7- delta / on both the top and bottom surfaces of a substrate by pulsed laser deposition is reported. This approach employs a metallic buffer layer to protect the first YBa/sub 2/Cu/sub 3/O/sub 7- delta / film while the second film is deposited. It is particularly applicable to microstrip-based circuit topologies where the ground plane conductor requires minimal patterning. The performance of microstrip ring resonators, fabricated by this technique, is substantially better than can be achieved with microstrip ring resonators which consist of a superconducting ring and a normal-conductor ground plane. This approach allows the deposition of YBa/sub 2/Cu/sub 3/O/sub 7- delta / on both sides of the substrate without the need for radiative heating schemes and can accommodate any size and shape of substrate.<>
Keywords :
barium compounds; high-temperature superconductors; microstrip lines; pulsed laser deposition; superconducting thin films; surface conductivity; yttrium compounds; MgO substrate; YBa/sub 2/Cu/sub 3/O/sub 7- delta / deposition; high temperature superconductor; metallic buffer layer; microstrip ring resonators; microstrip-based circuit topologies; microstrip-compatible technique; patterning; pulsed laser deposition; radiative heating schemes; surface resistance; Buffer layers; Microstrip components; Microstrip resonators; Optical pulses; Optical ring resonators; Protection; Pulsed laser deposition; Substrates; Superconducting films; Surface emitting lasers;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.233606
Filename :
233606
Link To Document :
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