DocumentCode :
942752
Title :
Enhanced hot-carrier-degradation in LDD MOSFET´s under pulsed stress
Author :
Shimoyama, Nobuhiro ; Tsuchiya, Toshiaki
Author_Institution :
NTT LSI Labs., Kanagawa, Japan
Volume :
42
Issue :
9
fYear :
1995
fDate :
9/1/1995 12:00:00 AM
Firstpage :
1600
Lastpage :
1604
Abstract :
Hot-carrier degradation of lightly doped drain (LDD) MOSFET´s under ac stress is investigated. Enhanced ac degradation occurs in LDD MOSFET´s as well as in single-drain MOSFET´s. However, there is a peculiar degradation mechanism in LDD MOSFET´s. For single-drain MOSFET´s, enhanced ac degradation appears in both threshold voltage and transconductance at stress drain voltages larger than a critical value. On the other hand, for LDD MOSFET´s, although the enhanced degradation in threshold voltage and transconductance appears at stress drain voltages larger than a critical value, the enhanced degradation in transconductance appears even under stress drain voltages lower than the critical value. The difference in the ac-enhanced degradation between LDD and single-drain structures can be explained by a hot hole generated neutral-electron-trap model and the change in hot-hole-injected oxide region according to stress bias conditions
Keywords :
MOSFET; electron traps; hot carriers; semiconductor device models; semiconductor device reliability; LDD MOSFET; ac degradation; degradation mechanism; hot hole generated neutral-electron-trap model; hot-carrier-degradation; hot-hole-injected oxide region; lightly doped drain; pulsed stress; stress bias conditions; threshold voltage; transconductance; Degradation; Frequency estimation; Hot carriers; Interface states; MOSFET circuits; Senior members; Stress; Threshold voltage; Transconductance; Very large scale integration;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.405273
Filename :
405273
Link To Document :
بازگشت