• DocumentCode
    944163
  • Title

    The effect of Ti conduit on the critical current in (NbTi)/sub 3/ Sn cable-in-conduit conductors

  • Author

    Ando, T. ; Nakajima, H. ; Hiue, H. ; Wadayama, Y.

  • Author_Institution
    JAERI, Ibaraki, Japan
  • Volume
    3
  • Issue
    1
  • fYear
    1993
  • fDate
    3/1/1993 12:00:00 AM
  • Firstpage
    488
  • Lastpage
    491
  • Abstract
    The authors investigated the effect of Ti conduit on the critical current in (NbTi)/sub 3/Sn cable-in-conduit conductors in comparison with stainless steel and copper-nickel alloy conduits. Ti has a coefficient of thermal expansion closely matching (NbTi)/sub 3/Sn and is expected to prevent the compressive thermal prestrain introduced in (NbTi)/sub 3/Sn filaments. As samples, two kinds of conductors were prepared, one consisting of seven (NbTi)/sub 3/Sn strands and the other of 36 (NbTi)/sub 3/Sn strands. The (NbTi)/sub 3/Sn strands produced by a bronze process had a diameter of 1.0 mm and a copper ratio of 2. The experimental results indicated that the critical current density in conductors with a Ti conduit and void fraction in the range of 5-46% nearly matched that of a single strand. From these results, Ti appears to be attractive as a practical conduit material for (NbTi)/sub 3/Sn cable-in-conduit conductors.<>
  • Keywords
    critical current density (superconductivity); fusion reactor theory and design; niobium alloys; superconducting cables; superconducting magnets; tin alloys; titanium alloys; voids (solid); (NbTi)/sub 3/Sn strands; 1 mm; Ti conduit effect; bronze process; cable-in-conduit conductors; compressive thermal prestrain; critical current density; fusion reactor; poloidal coil; thermal expansion; toroidal coil; void fraction; Conducting materials; Conductors; Copper alloys; Critical current; Iron alloys; Niobium compounds; Steel; Thermal expansion; Tin; Titanium compounds;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.233749
  • Filename
    233749