DocumentCode :
944332
Title :
Stability tests of module coil (TOKI-MC) wound with an aluminum stabilized superconductor
Author :
Mito, T. ; Sakamoto, M. ; Takahata, K. ; Yanagi, N. ; Nishimura, A. ; Yamada, S. ; Motojima, O. ; Yamamoto, J.
Author_Institution :
Nat. Inst. of Fusion Sci., Gifu, Japan
Volume :
3
Issue :
1
fYear :
1993
fDate :
3/1/1993 12:00:00 AM
Firstpage :
547
Lastpage :
550
Abstract :
The module coil TOKI-MC is a twisted solenoid coil wound with an aluminum stabilized superconductor developed as an R&D program for the Large Helical Device (LHD). The TOKI-MC can simulate the conductor and winding structure cooled by pool boiling helium, the twisted winding and the large electromagnetic force of the helical coils for LHD. The TOKI-MC was designed as a cryostable coil at an operating current of 20 kA, but the coil quenched around 17 kA in excitation tests. The cause of quenches was thought to be the result of wire movement. Stability tests were also carried out and the measured recovery current was less than the designed value. The degradation of recovery current was due to the excess magnetoresistivity of the copper clad aluminum stabilizer. The stability of TOKI-MC was evaluated and compared with the data of short sample tests.<>
Keywords :
copper; fusion reactor theory and design; niobium alloys; superconducting cables; superconducting magnets; titanium alloys; 17 kA; 20 kA; 4.2 K; 8 T; Cu-Al stabilised superconductor; LHD helical coils; Large Helical Device; NbTi-Cu compacted strand cable; R&D program; cryostable coil; electromagnetic force; excitation tests; fusion reactor; magnetoresistivity; module coil TOKI-MC; operating current; pool boiling He; quenching; recovery current; simulation; stability test; twisted solenoid coil; twisted winding; wire movement; Aluminum; Conductors; Electromagnetic forces; Solenoids; Stability; Superconducting coils; Testing; Wire; Wounds;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.233764
Filename :
233764
Link To Document :
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