Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards

As layout density increases in highly integrated multilayer printed circuit boards (PCBs), the noise that exists in the power distribution network (PDN) is increasingly coupled to the signal traces, and precise modeling to describe the coupling phenomenon becomes necessary. This paper presents a model to describe noise coupling between the power/ground planes and signal traces in multilayer systems. An analytical model for the coupling has been successfully derived, and the coupling mechanism was rigorously analyzed and clarified. Wave equations for a signal trace with power/ground noise were solved by imposing boundary conditions. Measurements in both the frequency and time domains have been conducted to confirm the validity of the proposed model.