Title :
Delamination problems of UV-cured adhesive bonded optical fiber in V-groove for photonic packaging
Author :
Uddin, M.A. ; Chan, H.P. ; Lam, K.W. ; Chan, Y.C. ; Chu, P.L. ; Hung, K.C. ; Tsun, T.O.
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, China
fDate :
4/1/2004 12:00:00 AM
Abstract :
In this letter, we investigated the origin of the interfacial delamination due to uneven curing of ultraviolet (UV) adhesive in the fixing process of a fiber on a V-groove. The analytical ray tracing technique is used to estimate the UV intensity at different locations along the adhesive-fiber interface. Consequently, the unexposed or shaded region in the adhesive layer is determined, through which the interfacial delamination as a result of the reliability test is predicted.
Keywords :
adhesive bonding; adhesives; curing; delamination; interface phenomena; optical fabrication; optical fibre testing; packaging; ray tracing; reliability; ultraviolet radiation effects; UV intensity; UV-cured adhesive bonded optical fiber; V-groove; adhesive layer; adhesive-fiber interface; analytical ray tracing technique; delamination problems; fixing process; interfacial delamination; photonic packaging; reliability test; ultraviolet adhesive; uneven curing; Assembly; Bonding; Curing; Delamination; Optical devices; Optical fiber devices; Optical fiber testing; Optical fibers; Packaging; Telecommunication network reliability;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2004.824639
