DocumentCode :
948200
Title :
Silicon carbide microwave MESFET´s
Author :
Clarke, R.C. ; Smith, T.J. ; Sriram, Srinath ; Barrett, D.L.
Author_Institution :
Westinghouse Sci. & Technol. Center, Pittsburgh, PA
Volume :
39
Issue :
11
fYear :
1992
fDate :
11/1/1992 12:00:00 AM
Firstpage :
2666
Abstract :
Summary form only given. The authors describe record-setting 5-GHz SiC MESFET performance and the effects of device design on achieving these results. Bulk growth of 6H-SiC was performed using a physical vapor transport process, and the resultant undoped single-crystal boules were sliced and polished to generate 1-in-diameter wafers. These wafers were then used as substrates for the chemical vapor deposition of doped silicon carbide active layers. Wafers contained 24 chips, each consisting of an array of MESFETs having systematically varied geometry. A sample DC characteristic from a 320-μm periphery MESFET showed a knee voltage of 8 V, a transconductance of 20 mS/mm, a maximum channel current of 210 mA/mm, and a gate-to-drain breakdown voltage of 100 V. Automated RF probing was used to obtain wafer maps of small signal gain, FT, and Fmax, revealing an excellent transistor yield of 87%. The highest-gain MESFETs in the array developed 12 dB of gain at 2 GHz with a cutoff frequency of 5 GHz
Keywords :
Schottky gate field effect transistors; chemical vapour deposition; semiconductor materials; silicon compounds; solid-state microwave devices; 100 V; 12 dB; 2 to 5 GHz; 20 mS; DC characteristic; MESFET performance; SiC; breakdown voltage; chemical vapor deposition; device array; doped active layer; microwave transistors; physical vapor transport process; undoped single-crystal boules; Breakdown voltage; Chemical vapor deposition; Geometry; Knee; MESFETs; Microwave devices; RF signals; Radio frequency; Silicon carbide; Transconductance;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.163535
Filename :
163535
Link To Document :
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