Title :
Lithographyless ion implantation technology for agile fab
Author :
Nishihashi, Tsutomu ; Kashimoto, Kazuhiro ; Fujiyama, Junki ; Sakurada, Yuzo ; Shibata, Takeshi ; Suguro, Kyoichi ; Sugihara, Kazuyoshi ; Okumura, Katsuya ; Gotou, Tadashi ; Saji, Nobuhito ; Tsunoda, Michio
Author_Institution :
ULVAC Inc., Shizuoka, Japan
fDate :
11/1/2002 12:00:00 AM
Abstract :
A new type of ion implanter developed for an agile fab can eliminate the processes concerned. with photoresist lithography from the ion implantation process. This new ion implantation technology can reduce the raw process time, footprint, and the cost of ownership to less than one-half that of conventional ion implantation technology. The authors are making further developments on this ion implanter and evaluating technical issues related to ion implantation. This technique is suitable for manufacturing submicron node IC devices. Based on the results of evaluating the prototype machine, we will produce the next β-machine.
Keywords :
VLSI; ion implantation; masks; β-machine; agile fab; cost of ownership; footprint; ion implantation process; lithographyless ion implantation technology; raw process time; stencil; submicron node IC devices; Agile manufacturing; Biomembranes; Costs; Electrostatics; Implants; Ion beams; Ion implantation; Lithography; Resists; Semiconductor device manufacture;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2002.804923
