• DocumentCode
    950403
  • Title

    Analysis and modeling of the transient local tunneling in gate oxides

  • Author

    Beug, M. Florian ; Ferretti, Rüdiger ; Hofmann, Karl R.

  • Author_Institution
    Inst. for Semicond. Devices & Electron. Mater., Univ. of Hannover, Germany
  • Volume
    4
  • Issue
    1
  • fYear
    2004
  • fDate
    3/1/2004 12:00:00 AM
  • Firstpage
    73
  • Lastpage
    79
  • Abstract
    This work presents a detailed investigation of the local transient tunneling currents due to substrate- and gate-near traps generated by Fowler-Nordheim stress in nitrided oxide MOS structures. We demonstrate that for the correct interpretation of the transient stress-induced leakage currents measured in the external circuit, it is essential to include the effects of the substrate and poly-Si capacitances. This leads to gate-voltage-dependent weighting factors, which relate the measured current transients to the local trap tunnel currents near the substrate and the gate. By a combination of these measurements with transient capacitance measurements, it is possible to separately determine the local tunnel currents and, thus, the densities of traps generated close to the substrate and to the gate.
  • Keywords
    EPROM; MIS structures; capacitance measurement; electron traps; leakage currents; silicon; silicon-on-insulator; transient analysis; tunnelling; EEPROM device; Fowler-Nordheim stress; MOS devices; Si; current transients; current weighting factors; gate-near traps; gate-voltage-dependent weighting factors; interface traps; nitrided gate oxide; nitrided oxide MOS structures; poly-Si capacitance; stress-induced leakage current; substrate capacitance; substrate-near traps; transient SILC; transient capacitance measurements; transient local tunneling; trap tunnel currents; Capacitance measurement; Circuits; Current measurement; Density measurement; Electron traps; Fault location; Leakage current; Substrates; Transient analysis; Tunneling;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2003.821528
  • Filename
    1284302