DocumentCode :
950462
Title :
Effects of interface trap generation and annihilation on the data retention characteristics of flash memory cells
Author :
Lee, Jae-Duk ; Choi, Jeong-Hyuk ; Park, Donggun ; Kim, Kinam
Author_Institution :
R&D Center, Samsung Electron. Co., Gyunggi-Do, South Korea
Volume :
4
Issue :
1
fYear :
2004
fDate :
3/1/2004 12:00:00 AM
Firstpage :
110
Lastpage :
117
Abstract :
It is revealed that the interface trap generation rate increases by Fowler-Nordheim current stressing on the tunnel oxide as the channel width of shallow-trench isolation (STI)-isolated NAND flash cells shrinks. Furthermore, we argue that the interface trap annihilation phenomenon during retention mode becomes a major failure mechanism of the data retention characteristics of sub-100-nm cells in addition to the conventional charge loss mechanism. A new interface trap analysis method using the hysteresis of the Id--Vg curve is proposed and shows that the interface traps consist of fast traps and slow traps.
Keywords :
MOSFET; electron traps; flash memories; hot carriers; interface states; leakage currents; Fowler-Nordheim current stressing; data retention characteristics; flash memory cells; hot carrier degradation; interface annihilation; interface trap analysis; interface trap generation; nand flash memory; shallow-trench isolation; tunnel oxide degradation; Character generation; Charge pumps; Degradation; Electron traps; Flash memory cells; Hysteresis; MOSFETs; Radiative recombination; Stress; Testing;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2004.824360
Filename :
1284307
Link To Document :
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