• DocumentCode
    950462
  • Title

    Effects of interface trap generation and annihilation on the data retention characteristics of flash memory cells

  • Author

    Lee, Jae-Duk ; Choi, Jeong-Hyuk ; Park, Donggun ; Kim, Kinam

  • Author_Institution
    R&D Center, Samsung Electron. Co., Gyunggi-Do, South Korea
  • Volume
    4
  • Issue
    1
  • fYear
    2004
  • fDate
    3/1/2004 12:00:00 AM
  • Firstpage
    110
  • Lastpage
    117
  • Abstract
    It is revealed that the interface trap generation rate increases by Fowler-Nordheim current stressing on the tunnel oxide as the channel width of shallow-trench isolation (STI)-isolated NAND flash cells shrinks. Furthermore, we argue that the interface trap annihilation phenomenon during retention mode becomes a major failure mechanism of the data retention characteristics of sub-100-nm cells in addition to the conventional charge loss mechanism. A new interface trap analysis method using the hysteresis of the Id--Vg curve is proposed and shows that the interface traps consist of fast traps and slow traps.
  • Keywords
    MOSFET; electron traps; flash memories; hot carriers; interface states; leakage currents; Fowler-Nordheim current stressing; data retention characteristics; flash memory cells; hot carrier degradation; interface annihilation; interface trap analysis; interface trap generation; nand flash memory; shallow-trench isolation; tunnel oxide degradation; Character generation; Charge pumps; Degradation; Electron traps; Flash memory cells; Hysteresis; MOSFETs; Radiative recombination; Stress; Testing;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2004.824360
  • Filename
    1284307