مرکز منطقه ای اطلاع رساني علوم و فناوري - Special issue on thermal management for reliability

DocumentCode :

950512

Title :

Special issue on thermal management for reliability

Volume :

Issue :

fYear :

2004

fDate :

3/1/2004 12:00:00 AM

Firstpage :

122

Lastpage :

122

Abstract :

Provides notice of upcoming special issues of interest to practitioners and researchers.

fLanguage :

English

Journal_Title :

Device and Materials Reliability, IEEE Transactions on

Publisher :

ieee

ISSN :

1530-4388

Type :

jour

DOI :

10.1109/TDMR.2004.827884

Filename :

1284312

Link To Document :