Electrical Modeling of Interconnections in Multilayer Packaging Structures

Author

Palusinski, Olgierd A. ; Liao, J.C. ; Teschan, Paul E. ; Prince, John L. ; Quintero, Francisco

Author_Institution

University of Arizona,Tuscon

Volume

10

Issue

2

fYear

1987

fDate

6/1/1987 12:00:00 AM

Firstpage

217

Lastpage

223

Abstract

An effort toward modeling the interconnections in selected typical multilayer packaging structures is presented. The modeling is based on a quasi-static approximation to the associated electro-magnetic problems. A program for computing capacitance and inductance matrices and the numerical techniques used to improve the program efficiency are described. The results of numerical testing of the program are provided and discussed. The program was also compared with experimental data published in the open literature and the results are shown. The agreement between the model and the experiments is satisfactory.

Keywords

Capacitance calculations; Inductance calculations; Integrated circuit interconnections; Integrated circuit packaging; Interconnections, Integrated circuits; Capacitance; Central Processing Unit; Circuit testing; Conductors; High speed integrated circuits; Inductance; Integrated circuit interconnections; Nonhomogeneous media; Packaging; Solid modeling;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/TCHMT.1987.1134722

Filename

1134722