• DocumentCode
    951276
  • Title

    Thermal Management of Air- and Liquid-Cooled Multichip Modules

  • Author

    Bar-Cohen, Avram

  • Author_Institution
    Control Data Corporation,MN
  • Volume
    10
  • Issue
    2
  • fYear
    1987
  • fDate
    6/1/1987 12:00:00 AM
  • Firstpage
    159
  • Lastpage
    175
  • Abstract
    The state-of-the-art in air- and liquid-cooled multichip modules is examined. An effort is made to identify the salient features of eight distinct modules, define their thermal characteristics, and establish a consistent basis for comparing and evaluating their thermal performance.
  • Keywords
    Integrated circuit thermal factors; CMOS technology; Control systems; Electron tubes; Electronic switching systems; Helium; Integrated circuit technology; Multichip modules; Switching circuits; Thermal management; Vacuum technology;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1987.1134734
  • Filename
    1134734
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=951276