Title :
Thermal Management of Air- and Liquid-Cooled Multichip Modules
Author :
Bar-Cohen, Avram
Author_Institution :
Control Data Corporation,MN
fDate :
6/1/1987 12:00:00 AM
Abstract :
The state-of-the-art in air- and liquid-cooled multichip modules is examined. An effort is made to identify the salient features of eight distinct modules, define their thermal characteristics, and establish a consistent basis for comparing and evaluating their thermal performance.
Keywords :
Integrated circuit thermal factors; CMOS technology; Control systems; Electron tubes; Electronic switching systems; Helium; Integrated circuit technology; Multichip modules; Switching circuits; Thermal management; Vacuum technology;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1987.1134734
