DocumentCode
951307
Title
Equations for Estimating Wire Length in Various Types of 2-D and 3-D System Packaging Structures
Author
Masaki, Akira ; Yamada, Minoru
Author_Institution
Hitachi Ltd.,Tokyo
Volume
10
Issue
2
fYear
1987
fDate
6/1/1987 12:00:00 AM
Firstpage
190
Lastpage
198
Abstract
Equations for estimating wire lengths in various types of two-dimensional (2-D) and three-dimensional (3-D) cell arrays are introduced´and applications of these equations are described. The singleplane packaging technique is compared with the stacked 2-D technique. The effect of increasing the number of edge connectors for Stacked 2-D designs is evaluated. Also the wire length in 3-D wafer computers is estimated.
Keywords
Integrated circuit interconnections; Integrated circuit packaging; Interconnections, Integrated circuits; Logic arrays; Wiring; Application software; Circuits; Connectors; Delay effects; Delay systems; Equations; Large scale integration; Packaging machines; Two dimensional displays; Wire;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1987.1134737
Filename
1134737
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