Title :
Stiffness and Yielding in the PLCC "J" Lead
Author :
Gee, Stephen A. ; Van Kessel, Cees G M
Author_Institution :
Philips Labs,Sunnyvale, CA
fDate :
9/1/1987 12:00:00 AM
Abstract :
The stiffness of the "J" lead in plastic leaded chip carrier (PLCC) packages is calculated using simple beam bending theory. These results are compared with experimentally determined values and used to estimate shear stress amplitudes in the solder joint. Yielding loads in "J" leads of varying geometries are also determined.
Keywords :
Integrated circuit mechanical factors; Integrated circuit packaging; Surface mounting; Amplitude estimation; Geometry; Lead; Manufacturing; Plastic packaging; Printed circuits; Soldering; Surface-mount technology; Thermal expansion; Thermal stresses;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1987.1134743
