DocumentCode :
951443
Title :
Stress and Deflection Analysis of Partially Routed Panels for Depanelization
Author :
Lau, John H. ; Barrett, George E.
Author_Institution :
Hewlett-Packard, CA
Volume :
10
Issue :
3
fYear :
1987
fDate :
9/1/1987 12:00:00 AM
Firstpage :
411
Lastpage :
419
Abstract :
Deflection and stress in partially routed panels have been studied by the finite element method. Emphasis is placed on the effects of partial routing on the assembly processes for surface mount printed circuit boards. To test the validity of the finite element results, the overall deflection profile of a partially routed panel was measured. The calculated deflection profile agreed with the experimental results. Two different tab configurations have been designed and for each design four connecting tab widths have been analyzed.
Keywords :
Assembly systems; FEM; Finite-element method (FEM); Mechanical factors; Surface mounting; Assembly; Ceramics; Circuit testing; Finite element methods; Joining processes; Lead; Manufacturing automation; Printed circuits; Routing; Stress;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1987.1134751
Filename :
1134751
Link To Document :
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