Title :
Association of Bonding-Wire Displacement With Gas Bubbles in Plastic-Encapsulated Integrated Circuits
Author :
Hunter, William L.
Author_Institution :
Motorola, AZ
fDate :
9/1/1987 12:00:00 AM
Abstract :
Evidence for the unexpected association of displaced wires with gas bubbles in plastic-encapsulated integrated circuits is presented. It is also shown that bubbles can be caused by entrainment of air in the compound as it flows through the molding tool. A mechanism which accounts for the frequent association of displaced bonding wires with the gas bubbles is suggested.
Keywords :
Integrated circuit bonding; Integrated circuit packaging; Bonding; Circuits; Displacement measurement; Plastics; Presses; Process control; Pulp manufacturing; Viscosity; Wires; X-ray imaging;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1987.1134759
