DocumentCode
951516
Title
Association of Bonding-Wire Displacement With Gas Bubbles in Plastic-Encapsulated Integrated Circuits
Author
Hunter, William L.
Author_Institution
Motorola, AZ
Volume
10
Issue
3
fYear
1987
fDate
9/1/1987 12:00:00 AM
Firstpage
327
Lastpage
331
Abstract
Evidence for the unexpected association of displaced wires with gas bubbles in plastic-encapsulated integrated circuits is presented. It is also shown that bubbles can be caused by entrainment of air in the compound as it flows through the molding tool. A mechanism which accounts for the frequent association of displaced bonding wires with the gas bubbles is suggested.
Keywords
Integrated circuit bonding; Integrated circuit packaging; Bonding; Circuits; Displacement measurement; Plastics; Presses; Process control; Pulp manufacturing; Viscosity; Wires; X-ray imaging;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1987.1134759
Filename
1134759
Link To Document