Title :
A New LSI Interconnection Method for IC Cards
Author :
Ohuchi, Masayuki ; Hongu, Akinori ; Saito, Masayuki ; Iida, Atsuko ; Yoshida, Kenichi ; Odaira, Hiroshi
Author_Institution :
Toshiba Corporation,Japan
fDate :
9/1/1987 12:00:00 AM
Abstract :
A new LSI interconnection method, the printed wiring connection (PWC) method, has already been developed. This method involves a planar interconnection, formed by screen printing, utilizing a polymeric conductor. Using this new method, an IC card was made, and the feasibility of applying this method to IC card packaging was investigated. The IC card developed has passed most reliability tests based on the ISO standard and several environmental tests to prove its application feasibility.
Keywords :
Financial data processing; Integrated circuit interconnections; Interconnections, Integrated circuits; Printed circuits; Semiconductor memories; Application specific integrated circuits; Bonding; EPROM; Integrated circuit packaging; Integrated circuit testing; Large scale integration; Microprocessors; Polymers; Proposals; Wiring;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1987.1134760
