• DocumentCode
    951554
  • Title

    Optimizing the Wire-Bonding Process for Copper Ball Bonding, Using classic Experimental Designs

  • Author

    Sheaffer, Michael ; Levine, Lee R. ; Schlain, Brian

  • Author_Institution
    Soffa Industires,PA
  • Volume
    10
  • Issue
    3
  • fYear
    1987
  • fDate
    9/1/1987 12:00:00 AM
  • Firstpage
    321
  • Lastpage
    326
  • Abstract
    Two classic experimental designs were used to develop the copper ball bonding process. A two-level factorial design was used to screen five process variables simultaneously and determine whether any of them had a significant effect on the process. A four-factor central composite design was used to optimize and map the bonding process window. The efficiency of using designed experiments allowed the development of the process and the achievement of a major milestone in only 15 experiments. The experimental designs which were used have wide application for process development and optimization. The concepts can be easily taught so that the experiments can become a standard for process technicians to follow. The use and analysis of these experimental designs are described.
  • Keywords
    Integrated circuit bonding; Optimization methods; Bonding processes; Conducting materials; Copper; Design for experiments; Design optimization; Gold; Response surface methodology; Semiconductor device manufacture; Testing; Wire;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1987.1134761
  • Filename
    1134761