DocumentCode :
951554
Title :
Optimizing the Wire-Bonding Process for Copper Ball Bonding, Using classic Experimental Designs
Author :
Sheaffer, Michael ; Levine, Lee R. ; Schlain, Brian
Author_Institution :
Soffa Industires,PA
Volume :
10
Issue :
3
fYear :
1987
fDate :
9/1/1987 12:00:00 AM
Firstpage :
321
Lastpage :
326
Abstract :
Two classic experimental designs were used to develop the copper ball bonding process. A two-level factorial design was used to screen five process variables simultaneously and determine whether any of them had a significant effect on the process. A four-factor central composite design was used to optimize and map the bonding process window. The efficiency of using designed experiments allowed the development of the process and the achievement of a major milestone in only 15 experiments. The experimental designs which were used have wide application for process development and optimization. The concepts can be easily taught so that the experiments can become a standard for process technicians to follow. The use and analysis of these experimental designs are described.
Keywords :
Integrated circuit bonding; Optimization methods; Bonding processes; Conducting materials; Copper; Design for experiments; Design optimization; Gold; Response surface methodology; Semiconductor device manufacture; Testing; Wire;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1987.1134761
Filename :
1134761
Link To Document :
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