DocumentCode
951554
Title
Optimizing the Wire-Bonding Process for Copper Ball Bonding, Using classic Experimental Designs
Author
Sheaffer, Michael ; Levine, Lee R. ; Schlain, Brian
Author_Institution
Soffa Industires,PA
Volume
10
Issue
3
fYear
1987
fDate
9/1/1987 12:00:00 AM
Firstpage
321
Lastpage
326
Abstract
Two classic experimental designs were used to develop the copper ball bonding process. A two-level factorial design was used to screen five process variables simultaneously and determine whether any of them had a significant effect on the process. A four-factor central composite design was used to optimize and map the bonding process window. The efficiency of using designed experiments allowed the development of the process and the achievement of a major milestone in only 15 experiments. The experimental designs which were used have wide application for process development and optimization. The concepts can be easily taught so that the experiments can become a standard for process technicians to follow. The use and analysis of these experimental designs are described.
Keywords
Integrated circuit bonding; Optimization methods; Bonding processes; Conducting materials; Copper; Design for experiments; Design optimization; Gold; Response surface methodology; Semiconductor device manufacture; Testing; Wire;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1987.1134761
Filename
1134761
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