• DocumentCode
    951619
  • Title

    A New Laser Hermetic Sealing Technique for Aluminum Package

  • Author

    Sakai, Takeaki ; Okamoto, Shusuke ; Iikawa, Tsutomu ; Sato, Takehiko ; Henmi, Zenzo

  • Author_Institution
    Fujitsu Labs,Atsugi, Japan
  • Volume
    10
  • Issue
    3
  • fYear
    1987
  • fDate
    9/1/1987 12:00:00 AM
  • Firstpage
    433
  • Lastpage
    436
  • Abstract
    A new laser hermetic sealing technique which combines nickel plating with laser welding has been developed for aluminum packages. Laser welding has proved to be the most promising hermetic sealing technique for the aluminum packages. However, laser welding of the package has been difficult because of aluminum´s tendency to suffer centerline cracks in the weld zone. Nickel was added in the weld zone by laser welding nickel-plated aluminum to strengthen the weld metal and prevent centerline cracks. With this aim, the optimum plating method and plating thickness were investigated. Consequently, electroless Ni-1wt%B, 5 µm in thickness was found to be best suited to the new technique, because the laser weld zone of the package exhibits a high joint strength almost equal to the tensile strength of the parent metal, and a package leakage of less than 10-9atm · cm3/s. The reliability of the hermetically sealed package was tested in accordance with MIL-STD-202F. It was confirmed that the new technique is suitable for the aluminum package for use in space, in the stratosphere and in salt-laden air.
  • Keywords
    Integrated circuit packaging; Laser welding; Seals; Aluminum; Electronic components; Electronic packaging thermal management; Gas lasers; Hermetic seals; Nickel; Temperature; Terrestrial atmosphere; Thermal conductivity; Welding;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1987.1134768
  • Filename
    1134768