DocumentCode :
951722
Title :
Life Estimation For IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics
Author :
Nishimura, Asao ; Tatemichi, Akihiro ; Miura, Hideo ; Sakamoto, Tatsuji
Author_Institution :
Hitachi Ltd,Japan
Volume :
10
Issue :
4
fYear :
1987
fDate :
12/1/1987 12:00:00 AM
Firstpage :
637
Lastpage :
642
Abstract :
The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range 
K. The crack propagation behavior in the package was estimated from the data of da/dN and K at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package Cracking problem is demonstrated.
K. The crack propagation behavior in the package was estimated from the data of da/dN and K at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package Cracking problem is demonstrated.Keywords :
Integrated circuit packaging; Integrated circuit thermal factors; Life estimation; Circuit testing; Fatigue; Finite element methods; Integrated circuit packaging; Laboratories; Length measurement; Life estimation; Plastic integrated circuit packaging; Stress; Temperature distribution;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1987.1134777
Filename :
1134777
Link To Document :
