• DocumentCode
    951822
  • Title

    High-Density Multipin Connector for High-Speed Pulse Propagation

  • Author

    Inagaki, Shuichiro ; Nakano, Ken-ichi

  • Author_Institution
    NTT Electrical Communications Lab.,Japan
  • Volume
    10
  • Issue
    4
  • fYear
    1987
  • fDate
    12/1/1987 12:00:00 AM
  • Firstpage
    496
  • Lastpage
    501
  • Abstract
    A Procedure for designing connectors suitable for gigabit per second (Gbit/s) rate pulse propagation is presented. A design chart for a multipin connector satisfying both electrical and mechanical requirements is obtained. The design procedure is as follows. First, the effect of varying the arrangement of ground contact springs on characteristic impedance is investigated using the finite-element method. Next, the effect of varying contact spring size and contact spring pitch is analyzed with respect to characteristic impedance and crosstalk. Finally, a design chart is constructed for the multipin connector by combining the mechanical characteristics of the contact springs with the aforementioned electrical characteristics. Based on the resulting design chart, a prototype multipin connector for a pin grid array is fabricated. The empirically derived electrical characteristics of the prototype connector are in good agreement with those predicted analytically.
  • Keywords
    Connectors; Electromagnetic transient propagation; Capacitance; Connectors; Contacts; Crosstalk; Electric variables; Electromagnetic propagation; Electronics packaging; Impedance; Prototypes; Springs;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1987.1134787
  • Filename
    1134787