A High Frequency Microcircuit Packaging and Interconnection System

The paper describes the development, characteristics, and application of a controlled impedance hermetic package (ClP) for microcircuit applications in microwave and fast-risetime pulse/digital domains. The primary motive is that of securing a significantly more economical packaging concept for high frequency microcircuits than is currently employed. Machined enclosures employing discrete coaxial connectors are currently widely used. A description is given of this planar package concept which is interfaceable with a strip transmission Iine motherboard. Pertinent electrical characteristics of the CIP including voltage standing wave ratio (VSWR) are presented. At this time, the upper limits of VSWR and frequency are 1.15 maximum at 5 gigahertz. The mechanical and physical characteristics, particularly the ability to secure reliable sealing and consequently hermetic-quality leak rates, are discussed. A description of CIP application methods including · microcircuit implanation, assembly, and-motherboard installation finalizes the presentation.