DocumentCode :
952409
Title :
Foreword: Special Issue on Hybrid Microelectronics
Author :
Clark, Robin
Author_Institution :
Adv. Microwave Dev. Group
Volume :
10
Issue :
2
fYear :
1974
fDate :
6/1/1974 12:00:00 AM
Firstpage :
87
Lastpage :
87
Keywords :
Hybrid integrated circuits; Application software; Electromagnetic heating; Fabrication; Hybrid integrated circuits; Microelectronics; Nonhomogeneous media; Packaging; Substrates; Thick films; Thin film inductors;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1974.1134846
Filename :
1134846
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=952409
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