DocumentCode :
952526
Title :
Foreword
Author :
Keys, L.
Author_Institution :
Guest Editor
Volume :
10
Issue :
3
fYear :
1974
fDate :
9/1/1974 12:00:00 AM
Firstpage :
151
Lastpage :
151
Keywords :
Electronic components; Electronics industry; Electronics packaging; Failure analysis; Integrated circuit interconnections; Radiation detector circuits; Radiation detectors; Stress; Thick film circuits; Transactions Committee;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1974.1134858
Filename :
1134858
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=952526
