DocumentCode :
952591
Title :
New Alumina Substrate for Hybrid Integrated Circuits
Author :
Niwa, Koichi ; Nakamura, Jun´ichi ; Murakawa, Kyohei ; Nakamura, Masahi
Author_Institution :
Fujitsu Labs, Ltd., Kawasaki, Japan
Volume :
10
Issue :
4
fYear :
1974
fDate :
12/1/1974 12:00:00 AM
Firstpage :
262
Lastpage :
266
Abstract :
A new alumina substrate with an extremely smooth surface was developed. This new alumina substrate includes Cr203and MgO as the additives. Reliability data and characteristics of tantalum nitride or tantalum and tantalum oxide films on the new substrate were compared with those on the glazed alumina.
Keywords :
Ceramic materials; Hybrid integrated circuits; Thin-film capacitors; Thin-film resistors; Capacitors; Ceramics; Chromium; Electronic components; Gold; Hybrid integrated circuits; Physics; Substrates; Temperature; Transistors;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1974.1134864
Filename :
1134864
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=952591
بازگشت