• DocumentCode
    952684
  • Title

    Resins for Embedding Microelectronic Devices

  • Author

    Harper, Charles A.

  • Author_Institution
    Westinghouse Electric Corporation, Friendship International Airport, Baltimore, MD
  • Volume
    11
  • Issue
    1
  • fYear
    1964
  • fDate
    3/1/1964 12:00:00 AM
  • Firstpage
    22
  • Lastpage
    27
  • Abstract
    This paper discusses the use of liquid resin systems for potting, casting or encapsulating microelectronic devices. Subject matter includes discussions on epoxies, silicones, polyurethanes, polyesters and thermosetting hydrocarbons and their modifications. Discussed in detail are the large number of modifications possible in epoxies using a variety of curing agents, flexibilizers and diluents. The important properties of the subject materials are discussed in regard to their utilization in microelectronic devices.
  • Keywords
    Ceramics; Dielectric substrates; Electronics packaging; Electrons; Glass; Microelectronics; Microscopy; Resins; Surface morphology; Thin films;
  • fLanguage
    English
  • Journal_Title
    Component Parts, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0097-6601
  • Type

    jour

  • DOI
    10.1109/TCP.1964.1134964
  • Filename
    1134964
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=952684