• DocumentCode
    952736
  • Title

    Interconnection Techniques for Microcircuits

  • Author

    Keister, F.Z. ; Engquist, R.D. ; Holley, J.H.

  • Author_Institution
    Hughes Aircraft Company, Culver City, CA
  • Volume
    11
  • Issue
    1
  • fYear
    1964
  • fDate
    3/1/1964 12:00:00 AM
  • Firstpage
    33
  • Lastpage
    41
  • Abstract
    The problem of how to interconnect today and tomorrow´s microminiature electronic circuit packages is one which is growing increasingly complex in view of the ever-diminishing size factor. It appears, however, that within a period of a few short years, many ingenious solutions to the interconnection problem have evolved. Some of these microcircuit interconnection techniques have proven their merit, while others are still under investigation. This paper describes twelve interconnection techniques, ranging from the relatively-simple soft soldering technique to highlyadvanced methods, such as electron beam welding and laser welding. An attempt has been made to present not only the mechanics of the various techniques, but to emphasize the materials, processes and equipment involved in each specific microcircuit interconnection method.
  • Keywords
    Copper; Electron beams; Integrated circuit interconnections; Integrated circuit reliability; Maintenance engineering; Optical materials; Packaging; Reliability engineering; Soldering; Welding;
  • fLanguage
    English
  • Journal_Title
    Component Parts, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0097-6601
  • Type

    jour

  • DOI
    10.1109/TCP.1964.1134969
  • Filename
    1134969