DocumentCode
952736
Title
Interconnection Techniques for Microcircuits
Author
Keister, F.Z. ; Engquist, R.D. ; Holley, J.H.
Author_Institution
Hughes Aircraft Company, Culver City, CA
Volume
11
Issue
1
fYear
1964
fDate
3/1/1964 12:00:00 AM
Firstpage
33
Lastpage
41
Abstract
The problem of how to interconnect today and tomorrow´s microminiature electronic circuit packages is one which is growing increasingly complex in view of the ever-diminishing size factor. It appears, however, that within a period of a few short years, many ingenious solutions to the interconnection problem have evolved. Some of these microcircuit interconnection techniques have proven their merit, while others are still under investigation. This paper describes twelve interconnection techniques, ranging from the relatively-simple soft soldering technique to highlyadvanced methods, such as electron beam welding and laser welding. An attempt has been made to present not only the mechanics of the various techniques, but to emphasize the materials, processes and equipment involved in each specific microcircuit interconnection method.
Keywords
Copper; Electron beams; Integrated circuit interconnections; Integrated circuit reliability; Maintenance engineering; Optical materials; Packaging; Reliability engineering; Soldering; Welding;
fLanguage
English
Journal_Title
Component Parts, IEEE Transactions on
Publisher
ieee
ISSN
0097-6601
Type
jour
DOI
10.1109/TCP.1964.1134969
Filename
1134969
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