Title :
A New Concept for Microminiature Interconnections
Author_Institution :
Burndy Cor.
fDate :
6/1/1964 12:00:00 AM
Keywords :
Conducting materials; Connectors; Contacts; Electronics packaging; Insulation; Integrated circuit interconnections; Protection; Springs; Sputtering; Thin film circuits;
Journal_Title :
Component Parts, IEEE Transactions on
DOI :
10.1109/TCP.1964.1134975
