Title :
New Interconnection Methods for Micro Circtuits
Author :
Northrup, J.B. ; Zachry, C.L.
Author_Institution :
Research and Dev. Center, Autonetics, A Div. of N. A. Aviation, Inc.
fDate :
6/1/1964 12:00:00 AM
Keywords :
Diffusion bonding; Electrodes; Gold; Lead; Photoconducting materials; Semiconductor materials; Springs; Substrates; Voltage; Welding;
Journal_Title :
Component Parts, IEEE Transactions on
DOI :
10.1109/TCP.1964.1134985
