Title :
Failure Modes in Thin Film Circuits
Author :
Smith, P. ; Genser, M. ; Serrette, R.
Author_Institution :
General Precision Aerospace, Little Falls, NJ
fDate :
6/1/1964 12:00:00 AM
Abstract :
A phase of a program is discussed in which some failure modes of thin film circuit modules were determined. Data is presented on the temperature distribution across a substrate and a discussion of the life performance of these substrates is given. Results of the use of these substrates in a functioning circuit are summarized.
Keywords :
Circuit testing; Electrical resistance measurement; Glass; Integrated circuit manufacture; Resistors; Stress; Substrates; Temperature distribution; Thermal resistance; Thin film circuits;
Journal_Title :
Component Parts, IEEE Transactions on
DOI :
10.1109/TCP.1964.1135003
