DocumentCode
953228
Title
The Micro-Circuit-Module, A Universal Interconnection-Packaging System
Author
Garibotti, D.J. ; Ullery, L.R.
Author_Institution
Hamilton Standard Div. of United Aircraft Cor.
Volume
11
Issue
2
fYear
1964
fDate
6/1/1964 12:00:00 AM
Firstpage
163
Lastpage
172
Abstract
An interconnection - packaging system -- Micro-Circuit-Module -- has been developed which is compatible with thin film as well as semiconductor integrated circuits. The system has evolved through the developmental stages and is now in the pilot production stage. The assembling and hermetic sealing of the module are carried out by automatic electron beam processes and associated transfer-indexing machines.
Keywords
Aerospace electronics; Assembly; Electron beams; Electronic components; Integrated circuit interconnections; Packaging; Resistance heating; Semiconductor thin films; Superconducting thin films; Thin film circuits;
fLanguage
English
Journal_Title
Component Parts, IEEE Transactions on
Publisher
ieee
ISSN
0097-6601
Type
jour
DOI
10.1109/TCP.1964.1135015
Filename
1135015
Link To Document