Title :
The Micro-Circuit-Module, A Universal Interconnection-Packaging System
Author :
Garibotti, D.J. ; Ullery, L.R.
Author_Institution :
Hamilton Standard Div. of United Aircraft Cor.
fDate :
6/1/1964 12:00:00 AM
Abstract :
An interconnection - packaging system -- Micro-Circuit-Module -- has been developed which is compatible with thin film as well as semiconductor integrated circuits. The system has evolved through the developmental stages and is now in the pilot production stage. The assembling and hermetic sealing of the module are carried out by automatic electron beam processes and associated transfer-indexing machines.
Keywords :
Aerospace electronics; Assembly; Electron beams; Electronic components; Integrated circuit interconnections; Packaging; Resistance heating; Semiconductor thin films; Superconducting thin films; Thin film circuits;
Journal_Title :
Component Parts, IEEE Transactions on
DOI :
10.1109/TCP.1964.1135015
