DocumentCode
953265
Title
Microphysical investigations on mechanical structures realized in p + silicon
Author
Cabuz, Cleopatra ; Fukatsu, Keisuke ; Kurabayashi, Tom ; Minami, Kazuyuki ; Esashi, Masayoshi
Author_Institution
Fac. of Eng., Tohoku Univ., Sendai, Japan
Volume
4
Issue
3
fYear
1995
fDate
9/1/1995 12:00:00 AM
Firstpage
109
Lastpage
118
Abstract
Secondary Ion Mass Spectroscopy (SIMS) and Microprobe Raman Spectroscopy (MRS) together with optical evaluation of cantilever bending were used for the characterization of micromechanical structures realized in p+ silicon. Boron profiles in different steps of the fabrication process were accurately traced by SIMS. SIMS is, however, a destructive method. MRS is a noncontact, nondestructive method with high spatial resolution. It was used to evaluate boron concentration in the near surface region, together with lattice disorder and stresses. Mechanical behavior of p+ microstructures was found to be strongly related to the history of boron concentration profile. Parameters of Raman spectra are in direct relation with the level of boron in the near surface region. Such measurements can be used for p+ layer monitoring during the fabrication process and for the prediction of mechanical behavior in the final structure. A new explanation is suggested for the observed compressive behavior of oxidized/annealed p+ microstructures. It is based on the hysteresis introduced by the plastic deformations in the strain-concentration characteristic of the diffused layer. Detailed investigations in better technological environment could bring an accurate quantitative description of the phenomena with useful connections between Raman frequencies and elastic constants of the p+ layer
Keywords
Raman spectra; bending; boron; doping profiles; elemental semiconductors; internal stresses; micromechanical devices; plastic deformation; secondary ion mass spectra; semiconductor doping; silicon; Microprobe Raman Spectroscopy; Secondary Ion Mass Spectroscopy; Si:B; boron concentration profile; cantilever bending; diffused layer; elastic constants; fabrication; hysteresis; lattice disorder; micromechanical structures; noncontact nondestructive method; oxidized annealed microstructures; p+ silicon; plastic deformation; strain-concentration characteristic; stresses; Boron; Lattices; Mass spectroscopy; Micromechanical devices; Microstructure; Optical device fabrication; Particle beam optics; Raman scattering; Silicon; Spatial resolution;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/84.465124
Filename
465124
Link To Document