Author :
Kato, Toshihiko ; Yuuki, F. ; Tanaka, Kiyoshi ; Tanaka, Hiroya ; Masuda, Hiroji ; Tanoue, Takuya ; Oishi, A. ; Ito, Kei ; Murakami, Kazuki ; Teraoka, Takashi
Abstract :
A new two-dimensional array optical interconnection construction is developed for the board-to-board level. A high throughput density of 21 Gbit/s/cm2 over the electric coaxial cable limit is achieved by the direct hybridisation of an 8*2-channel LD/PD array onto the transmitter/receiver IC and surface-mount packaging of a microlens array and a fibre-connector receptacle.
Keywords :
optical couplers; optical fibres; optical interconnections; printed circuits; board-to-board level; direct hybridisation; electric coaxial cable limit; fibre-connector receptacle; microlens array; surface-mount packaging; throughput density; transmitter/receiver IC; two-dimensional array optical interconnection;
