Effect of channel width on pool boiling from a microconfigured heat sink

Author

Nowell, Ronald M., Jr. ; Bhavnani, Sushil H. ; Jaeger, Richard C.

Author_Institution

Dept. of Mech. Eng., Auburn Univ., AL, USA

Volume

18

Issue

3

fYear

1995

fDate

9/1/1995 12:00:00 AM

Firstpage

534

Lastpage

539

Abstract

Two-phase liquid immersion cooling of computers is becoming an increasingly favorable heat removal strategy. A re-entrant cavity heat sink has been developed to address these needs. In confined situations, the vapor generated moves through the channel formed between adjacent substrates. Bubble transport is therefore affected by the channel width. Saturated pool boiling results are presented and discussed for vertically oriented channels of widths ranging from 0.1 cm to 0.6 cm to cover typical values likely to be encountered. The heat source was a deposited aluminum thin film heater of size 0.9 cm by 0.9 cm. The cavities were laid out over a 2.5 cm by 2.5 cm area. Testing was carried out in FC-72, It was found that the presence of a parallel plate affected the heat transfer performance adversely

Keywords

boiling; bubbles; channel flow; cooling; heat sinks; integrated circuit packaging; two-phase flow; 0.1 to 0.6 cm; Al thin film heater; FC-72; Si wafer; bubble transport; channel width; heat removal strategy; heat transfer performance; microconfigured heat sink; microelectronics cooling; reentrant cavity heat sink; saturated pool boiling; two-phase liquid immersion cooling; vertically oriented channels; Cooling; Heat engines; Heat sinks; Heat transfer; Microelectronics; Silicon; Space heating; Substrates; Thermal conductivity; Viscosity;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.465149

Filename

465149