• DocumentCode
    953470
  • Title

    Entrance analysis of turbulent flow in an array of heated rectangular blocks

  • Author

    Faghri, Mohammed ; Molki, Majid ; Chrupcala, John ; Asako, Yutaka

  • Author_Institution
    Dept. of Mech. Eng. & Appl. Mech., Rhode Island Univ., Kingston, RI, USA
  • Volume
    18
  • Issue
    3
  • fYear
    1995
  • fDate
    9/1/1995 12:00:00 AM
  • Firstpage
    546
  • Lastpage
    552
  • Abstract
    A numerical study is conducted to investigate the entrance behavior of turbulent flow over arrays of rectangular heated blocks. The problem formulation is three dimensional and the solution domain includes both the developing and fully developed regions of the array. The blocks are deployed along the lower wall of a parallel-plate duct in an attempt to simulate the cooling passages of electronics equipment, The standard k-ε turbulence model was applied to the developing region of the flow at high Reynolds numbers, while a modified Lam-Bremhorst turbulence model was considered at low Reynolds numbers. The computations are performed for two conventional thermal boundary conditions, namely constant heat flux and constant wall temperature. Reynolds numbers ranged from 102 to 105, with the Prandtl number being equal to 0.7. The array geometry was identified with H/L=1/8, S/L=1/8, B/L=1/2 and the entrance length, I/L=1/2, 2, and 6. To evaluate the accuracy of the turbulence models, numerical solutions were compared with experiment
  • Keywords
    cooling; packaging; turbulence; block array; constant heat flux; constant wall temperature; cooling passages; electronics equipment; entrance analysis; heated rectangular blocks; high Reynolds numbers; low Reynolds numbers; modified Lam-Bremhorst turbulence model; parallel-plate duct; standard k-ϵ turbulence model; thermal boundary conditions; turbulent flow; Boundary conditions; Computational modeling; Ducts; Electronic equipment; Electronics cooling; Friction; Standards development; Temperature; Thermal conductivity; Viscosity;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.465151
  • Filename
    465151