Title :
Enhancement of a two-phase thermosyphon for cooling high heat flux power devices
Author :
Kuwahara, Heikichi ; Takahashi, Kenji ; Nakajima, Tadakatsu ; Takasaki, Toshio ; Suzuki, Osamu
Author_Institution :
Mech. Eng. Res. Lab., Hitachi Ltd., Ibaraki, Japan
fDate :
9/1/1995 12:00:00 AM
Abstract :
The purpose of this study is the enhancement of cooling of high heat flux power devices such as a thyristor by a thermosyphon system. The thermosyphon uses boiling and condensation of an inert dielectric fluorocarbon (FC-72). Boiling occurs from a multiple chimney heat transfer structure. A boiling chamber is connected to the condenser by a double tube, with the inner tube carrying the condensed liquid and the outer annulus carrying vapor. Using the experimental model of a thermosyphon, heat flux capacity is enhanced by increasing the flow tube height H0, boiling chamber height Hh, and condenser liquid level Hl. High heat flux capacity is achieved with H0>8 cm, Hh>10 cm, and Hl >H0, using the chimney heat transfer structure with a channel width of 3 mm. The thermosyphon system is able to cool a maximum heat flux of 3 kW per device
Keywords :
boiling; condensation; cooling; heat sinks; semiconductor device packaging; thyristors; two-phase flow; 3 kW; 3 mm; FC-72; GTO thyristor; boiling; boiling chamber height; channel width; chimney heat sink; condensation; condenser liquid level; cooling; flow tube height; heat flux capacity; high heat flux power devices; inert dielectric fluorocarbon; multiple chimney heat transfer structure; two-phase thermosyphon; Dielectrics; Heat sinks; Heat transfer; Laboratories; Mechanical engineering; Particle separators; Refrigerants; Space cooling; Space heating; Thyristors;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
