• DocumentCode
    953602
  • Title

    MIC Packaging Using Conductive Epoxy and Numerically Controlled Drill Techniques

  • Author

    Palermo, Carmine ; Hartman, Jeff

  • Author_Institution
    General Dynamics, Fort Worth, Tex.
  • Volume
    11
  • Issue
    2
  • fYear
    1975
  • fDate
    6/1/1975 12:00:00 AM
  • Firstpage
    157
  • Lastpage
    158
  • Abstract
    A new packaging method has been developed for microwave balanced stripline circuits which combines the advantages of numerically controlled drill techniques and the low cost wellknown methods of liquid resin molding. Microwave couplers were constructed using this technique which showed excellent mechanical properties and whose electrical properties were unchanged before and after potting.
  • Keywords
    Integrated circuit packaging; Stripline couplers; Attenuation; Conductivity; Costs; Electronics packaging; Fasteners; Integrated circuit packaging; Microwave circuits; Microwave integrated circuits; Microwave theory and techniques; Stripline;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1975.1135052
  • Filename
    1135052
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=953602