Title :
High-speed chip-to-chip optical interconnect
Author :
Jelley, K.W. ; Valliath, G.T. ; Stafford, J.W.
Author_Institution :
Motorola Corp. Manuf. Res. Center, Schaumburg, IL, USA
Abstract :
An intraboard chip-to-chip optical interconnect has been demonstrated as a compatible and potentially manufacturable last step in the conventional multichip module process. Chip-to-chip optical communication at 1 Gb/s NRZ was achieved using an edge emitting laser, a flip-chip p-i-n photodetector and a photodefined polymer optical waveguide.<>
Keywords :
multichip modules; optical interconnections; optical waveguides; photodetectors; 1 Gbit/s; NRZ; edge emitting laser; flip-chip p-i-n photodetector; intraboard chip-to-chip optical interconnect; multichip module process; photodefined polymer optical waveguide; Manufacturing processes; Multichip modules; Optical fiber communication; Optical interconnections; Optical polymers; Optical signal processing; Optical waveguides; PIN photodiodes; Photodetectors; Waveguide lasers;
Journal_Title :
Photonics Technology Letters, IEEE
