Title :
RF power characteristics of SiGe HBTs at cryogenic temperatures
Author :
Hsieh, Meng-Wei ; Hsin, Yue-Ming ; Liang, Kung-Hao ; Chan, Yi-Jen ; Tang, Denny
Author_Institution :
Dept. of Electr. Eng., Nat. Central Univ., Taoyuan, Taiwan
fDate :
6/1/2006 12:00:00 AM
Abstract :
This paper investigates the temperature dependence (from 77 to 300 K) of dc, ac, and power characteristics for n-p-n SiGe heterojunction bipolar transistors (HBTs) with and without selectively implanted collector (SIC). In SiGe HBTs without SIC, the valance band discontinuity at the base-collector heterojunction induces a parasitic conduction band barrier while biasing at saturation region and high current operation at cryogenic temperatures. This parasitic conduction band barrier significantly reduces the current gain and cutoff frequency. For transistors biased with fixed collector current, the measured output power, power-added efficiency, and linearity at 2.4 GHz decrease significantly with decreasing operation temperatures. The temperature dependence of output power characteristic is analyzed by Kirk effect, current gain, and cutoff frequency at different temperatures. The parasitic conduction band barrier in SiGe HBTs with SIC is negligible, and thus the device achieves better power performance at cryogenic temperatures compared with that in SiGe HBT without SIC.
Keywords :
Ge-Si alloys; conduction bands; cryogenic electronics; heterojunction bipolar transistors; 2.4 GHz; 77 to 300 K; Kirk effect; RF power characteristics; SiGe; SiGe HBT; SiGe heterojunction bipolar transistors; base-collector heterojunction; cryogenic temperatures; current gain; cutoff frequency; fixed collector current; parasitic conduction band barrier; power capability; power-added efficiency; selectively implanted collector; valance band discontinuity; Cryogenics; Current measurement; Cutoff frequency; Germanium silicon alloys; Heterojunction bipolar transistors; Power generation; Radio frequency; Silicon carbide; Silicon germanium; Temperature dependence; Conduction band barrier; cryogenic temperatures; power capability;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2006.874156