Title :
Impact of interfacial layer on low-frequency noise of HfSiON dielectric MOSFETs
Author :
Min, Bigang ; Devireddy, Siva Prasad ; Çelik-Butler, Zeynep ; Shanware, Ajit ; Colombo, Luigi ; Green, Keith ; Chambers, J.J. ; Visokay, M.R. ; Rotondaro, Antonio Luis Pacheco
Author_Institution :
Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
fDate :
6/1/2006 12:00:00 AM
Abstract :
Low-frequency noise measurements and analysis were performed on n-channel MOSFETs with HfSiON as the gate-dielectric material. The role of SiON interfacial-layer thickness was investigated. It was observed that these fluctuations can be described by the unified flicker-noise model that attributes noise to correlated carrier-number/mobility fluctuations due to trapping states in the gate dielectric. The model was modified to include the effect of different gate stack layers on the observed noise. The carrier-number fluctuations were found to dominate over the correlated mobility fluctuations in the measured bias range and more so at the lower gate overdrives. The noise magnitude showed a decrease with increasing SiON interfacial-layer thickness. Furthermore, an inverse-proportionality relationship was revealed between the effective oxide trap density and SiON thickness.
Keywords :
MOSFET; carrier mobility; dielectric materials; flicker noise; hafnium compounds; semiconductor device models; semiconductor device noise; silicon compounds; HfSiON; HfSiON dielectric MOSFET; correlated carrier-number fluctuations; correlated mobility fluctuations; gate overdrives; gate stack layers; gate-dielectric material; interfacial layer; low-frequency noise; oxide trap density; trapping states; unified flicker-noise model; Attenuation; Electron mobility; Electron traps; Fluctuations; High K dielectric materials; High-K gate dielectrics; Low-frequency noise; MOSFETs; Semiconductor device noise; Wave functions; HfSiON; MOSFET; high-; interfacial layer (IL); low-frequency (LF) noise; oxide trap density;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2006.874759