Reactively Bonded Thin-Film Conductors, a New Component for Combination Thin- and Thick-Film Technology

Author

Reiss, Steve

Author_Institution

GTE Sylvania, Incorp.

Volume

11

Issue

3

fYear

1975

fDate

9/1/1975 12:00:00 AM

Firstpage

190

Lastpage

194

Abstract

A ´thin-film reactively bonded gold alloy has been developed. This material is similar in composition and physical properties to thick-film reactively bonded golds. It is a vacuum-deposited material that is fired in air at high temperatures (1000°C) to form a strong bond with ceramic substrates. Thin-film reactively bonded gold is a dense, smooth rhaterial with high electrical conductivity. This alloy can withstand repeated firings in the 850 to 1000° temperature range and is compatible with most thick-film materials including dielectrics, resistors and conductors. It can be ,easily etched into fine geometrics (very high yield with one-mil line and one-mil spaces), making it a good candidate for high density interconnect technology.

Keywords

Bonding; Copper alloys/compounds; Gold alloys/compounds; Integrated circuit interconnections; Interconnections, Integrated circuits; Thick-film circuits; Thin-film circuits; Bonding; Ceramics; Composite materials; Conducting materials; Conductive films; Dielectric substrates; Gold alloys; Space technology; Temperature; Transistors;

fLanguage

English

Journal_Title

Parts, Hybrids, and Packaging, IEEE Transactions on

Publisher

ieee

ISSN

0361-1000

Type

jour

DOI

10.1109/TPHP.1975.1135070

Filename

1135070