• DocumentCode
    954094
  • Title

    Intermetallic Growth and Contact Resistance of Tin Contacts After Aging

  • Author

    Lindborg, Ulf ; Asthner, Bengt ; Lind, Lena ; Révay, László B.

  • Author_Institution
    L M Ericsson Telephone Company,Sweden
  • Volume
    12
  • Issue
    1
  • fYear
    1976
  • fDate
    3/1/1976 12:00:00 AM
  • Firstpage
    33
  • Lastpage
    39
  • Abstract
    The microstructure and the X-ray diffraction properties were studied for tin electroplates deposited from bright acid baths as well as from a stannate bath. Aging at 50°C for 7 years, largely converted 5µm coatings to various intermetallic compounds: Cu6Sn5and Cu3Sn or Ni3Sn4depending on the substrate. Dull tin electroplates showed low contact resistance also after aging in spite of a large proportion intermetallic phase at the surface. Bright tin from acid sulphate baths of three different formulations and in particular a tin-nickel alloy coating showed high contact resistances after aging. It seems very doubtful that bright tin could replace gold. Dull tin or tin-lead may offer better chances.
  • Keywords
    Contacts; Resistance; Tin; Aging; Circuits; Coatings; Contact resistance; Copper alloys; Electrical resistance measurement; Intermetallic; Seminars; Surface resistance; Tin;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1976.1135097
  • Filename
    1135097
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=954094