Title :
Theoretical Calculation of the Thermal Resistance of a Conducting and Convecting Surface
Author :
Ellison, Gordon N.
Author_Institution :
Tektronix,Beaverton,OR
fDate :
9/1/1976 12:00:00 AM
Abstract :
A closed-form theoretical expression has been derived for the conductive and convective thermal resistance of frequently used electronic component and package covers. Numerical results are plotted in a manner that is applicable to a variety of devices such as flat packs, dual-in-line packages, and ceramic circuit cards,
Keywords :
Hybrid integrated circuits; Integrated circuit packaging; Semiconductor device thermal factors; Surfaces; Ceramics; Circuits; Differential equations; Electronic components; Electronic packaging thermal management; Resistance heating; Surface resistance; Temperature; Thermal conductivity; Thermal resistance;
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
DOI :
10.1109/TPHP.1976.1135130
