DocumentCode

954572

Title

Foreword

Author

Tapp, Chris

Author_Institution

IEEE PHP--1976

Volume

12

Issue

3

fYear

1976

fDate

9/1/1976 12:00:00 AM

Firstpage

166

Lastpage

166

Keywords

Electronic components; Electronics packaging; Electrostatic discharge; Encapsulation; Hardware; MOS devices; Moisture; Protection; Resistors; Welding;

fLanguage

English

Journal_Title

Parts, Hybrids, and Packaging, IEEE Transactions on

Publisher

ieee

ISSN

0361-1000

Type

jour

DOI

10.1109/TPHP.1976.1135144

Filename

1135144